We provide Printed circuit board (PCB) assembly including tailor made turn-key services. We have fully Automated and Robust SMT machinery which comprises of multiple Fuji Printer, Koh Young 3D SPI, Fuji SMT machines, Panasonic SMT machine, 13 Zone Reflow Oven, Koh Young 3D AOI and Nordson Dage 160kV/3W X-ray machine at our class 100000 Cleanroom facility. We also provide back-end assembly and testing for prototyping, low volume high mix to high volume services. We have state-of-the-art electronic product assembly machinery that provides optimal capacity utilization, passing savings in time and cost to our customers.
- SMT Line capacity of 200000 CPH.
- We assemble Rigid, Flex and Rigid-Flex PCBs.
- 48 x 48mm to 510mm x 590mm PCB handling capability.
- 01005, 0201,PBGA, FBGA, Micro-BGA, CSP, Ultra-fine pitch QFP & QFN mounting capability.
- Ultrasonic Solder Paste Cleaning.
- Solder paste printer wet print accuracy 6σ [CpK ≥ 2.0].
- 3D SPI Inspection for paste deposit supported from 3.94 mils.
- Mounter accuracy of 0.025 mm, Cpk ≥ 1.00 (3σ).
- Supports Fine pitch components (01005 & 0201).
- HMLV & LMHV SMT Line.
- Intelligent smart feeders (4mm to 72mm & 3 vibratory stick feeders).
- 13 Zone Reflow Oven (Nitrogen ready, Chiller unit & Board drop sensor).
- 3D AOI (25mm 3D Height Inspection & RTM).
- Manual Insertion Line.
- Automated wave soldering/Manual Soldering for Through Hole components.
- Dedicated space available Post SMT & THT processes for customer specific turnkey/tailor made services.
- SPI closed loop feedback with Paste printer.
- Interlinking between Inline 3D SPI & 3D AOI through KSMART Advanced server.
- PCB baking, Automatic stencil cleaning, MSD component storage (Dr. Storage) capability.
