Our PCB assembly services are best in market to work closely with our customers to meet their latest technology needs with best quality methods for new components packages, such as micro-BGAs (Ball Grid Array) and other products. We always provide manufacturing services to comply with new environmental regulations.
PCBA TECHNOLOGIES AND PACKAGES
- Surface Mount Technology (SMT)
- Pin Through Hole (PTH)
- Intrusive Reflow
- Package-on-Package (POP)
- Chip Scale Package (CSP)
- Ball Grid Array (BGA, uBGA)
- Fine Pitch Devices (QFP, 0.3mm)
- Miniature Components (01005)
MANUFACTURING PROCESSES
- Tin-Lead & Lead-Free (RoHS) Assembly
- Nitrogen (N2) Reflow Process
- Wire-bonding
- Press-fit
- Wave Solder
- Chemical and Aqueous cleaning
- Various PCB Surface Finishes (HASL, ENIG, IS, OSP)
MANUFACTURING INFORMATION SERVICES
- Real-Time Process Tracking & Control
- Real-Time Statistical Process Control (SPC)
Manufacturing Capabilities
| Minimum chip component size | 01005 |
| Maximum component size | 54 mm square, 45 mm x 150 mm |
| Maximum board handling size | 508 mm x 400 mm x 5 mm |
| Minimum board handling size | 50 mm x 50 mm x 0.3 mm |
| Placement accuracy | 0.05 mm (Chip), 0.025 mm (QFP) |
| Speed | 100000 cph |
| Soldering |
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| Inspection |
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| Testing | ICT |
| BGA Inspection | Nordson Dage plus X-Ray Inspection System |